21 February, 2022
Currently the Chalmers team (Frida Strömbeck, Yan Yu, Gregor Lasser, Herbet Zirath, Sining An, Marzieh Mollaapouramiri, and Simon He [missing in the picture]) is working hard on characterizing delivery BiCMOS chip designs of 160GHz and 260 GHz transceivers. The on-wafer measurement of the transceivers MMICs is performed and showing promising result of above 100 Gbps data transmission.
The chip packaging work is also ongoing both using CNC machines waveguide blocks and eWLB packaging. The chipset and packaging works are toward two system demonstrators in the Car2TERA project, which are expected by the end of 2022.